Extreme Ultraviolet (EUV) Lithography technology is used to print intricate layers with controlled wavelengths on chips

 

Extreme ultraviolet (EUV) lithography

Extreme ultraviolet (EUV) lithography is a good option for manufacturers who want to manufacture smaller, faster processors. EUV uses a laser with a wavelength of 13.5 nanometers. It's much shorter than deep UV, so it's ideal for putting tiny transistors onto complex chips. EUV is also more accurate than UV, making it easier to create high-quality printed lines. A high-NA laser also reduces downtime. In addition to this, EUV is cheaper to produce the same number of chips.

According to Coherent Market Insights, The global Extreme Ultraviolet (EUV) Lithography market was valued at US$ 4,660.4 Mn in 2020 and is expected to reach US$ 29,648.4 Mn by 2028 at a CAGR of 26.1% between 2021 and 2028.

The next generation of Extreme Ultraviolet (EUV) Lithography can be productive, but there are still many practical issues. First of all, a good light source is essential. A discharge-plasma-based source is a promising option, but it is expensive and requires many elements. Second-generation EUV lithography machines will also require solutions to several hard problems. These will be discussed in the following sections. In the meantime, engineers can focus on the practical issues of EUV lithography.

Extreme ultraviolet (EUV) lithography requires a high-power light source. While discharge-plasma sources are being touted as an option, they are still not efficient enough for large-scale production. Another hurdle is the wavelength. In the near future, the technology could be surpassed by the resolution demands of semiconductor metal layers. This technology is expected to continue to improve as research and development activities increase the sophistication of EUV lithography systems.

Another critical technical issue in Extreme Ultraviolet (EUV) Lithography is the resist material. It needs to have excellent characteristics, such as high resolution, sensitivity, and low line-edge roughness. It must also exhibit low outgassing. Further research is needed to develop better materials that will withstand EUV lithography. For instance, in May 2022, ASML Holding, a major semiconductor provider in Germany, introduced a recovery plan to restart the semiconductor production at its Berlin facility using extreme ultraviolet (EUV) lithography technology.

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